| 铜合金在海水中电化学阻抗谱特征研究 |
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| 引用本文： | 赵永韬,李海洪,陈光章.铜合金在海水中电化学阻抗谱特征研究[J].海洋科学,2005,29(7):21-25. |
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| 作者姓名： | 赵永韬 李海洪 陈光章 |
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| 作者单位： | 海洋腐蚀与防护国防科技重点实验室,洛阳船舶材料研究所青岛分部,山东,青岛,266071 |
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| 基金项目： | 国家“十·五”重点资助项目(CZB1.1-1) |
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| 摘 要： | 利用电化学阻抗谱(EIS)对紫铜和铜镍合金在静止、洁净海水中表面成膜的过程进行了监测，根据不同阶段的EIS特征建立不同等效电路模型进行拟合分析。获得了铜合金基体及其表面膜层对应的界面电化学信息参数，通过比较3种金属(B10，TUP，B30)表面膜层随时间变化的差异。探讨了合金成分对表面成膜过程的影响。结果表明。浸泡前期B10和TUP的耐蚀性较差，但随着海水中浸泡时间增加，三者的耐蚀能力逐渐接近。TUP的EIS显示了其表面内、外膜层信息。B10表面膜层的成长速度和稳定性均不如B30，反映出合金中镍含量的增多，增加了铜镍合金表面成膜产生钝化的效应。
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| 关 键 词： | 电化学阻抗谱（EIS） 铜镍合金 海水 表面膜 |
| 文章编号： | 1000-3096(2005)07-0021-05 |
| 收稿时间： | 2005/3/21 0:00:00 |
| 修稿时间： | 2005年3月21日 |
EIS characteristics of Cu-based alloy in seawater |
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| ZHAO Yong-tao,LI Hai-hong,CHEN Guang-zhang.EIS characteristics of Cu-based alloy in seawater[J].Marine Sciences,2005,29(7):21-25. |
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| Authors: | ZHAO Yong-tao LI Hai-hong CHEN Guang-zhang |
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| Abstract: | Film-forming behavior of copper alloy in clean and static seawat er was monitored using EIS method.According to the EIS characteristics of differ ent immersion durations,corresponding equivalent circuits were developed,and t he electrochemical parameters of the corrosion system were obtained.Variations i n surface film of different copper alloys were compared to discuss the effect of alloy elements on film-forming.The results showed that both B10and TUP do not h ave a good performance of anti-corrosion in early stage of immersion.However,th eir corrosion resistance would be close to that of B30with increasing immersion t ime in seawater.The EIS of TUP revealed the information of inner and outer layer s of the film,and B10does not has the same performance on growth and stability o f surface film as B30does,which indicated that the increase of nickel is benefi cial to the passivation tendency of Cu-Ni alloys. |
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| Keywords: | EIS TUP Cu-Ni-Alloy seawater surface film |
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