| 粘附功方程的调和函数形式 |
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| 引用本文： | 彭策.粘附功方程的调和函数形式[J].测绘学院学报,1989(1). |
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| 作者姓名： | 彭策 |
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| 摘 要： | 粘附功是描述界面上不同分子间相互作用的重要参量。本文给出了以调和函数的形式构成粘附功方程的具体表达式,探讨了方程中因子的变化特性,结合印版界面,应用方程对一些研究成果进行了验证。结果表明,以这种形式构成方程得出的结论比较符合印版界面的实际情况。最后,本文应用方程参量解释了印版界面上分子相互作用的状态。
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| 关 键 词： | 印版 表面能 调和函数 相互作用参数 粘附功 |
THE HARM OMC FUNCTION EXPRESSION OF THE ADHESIONAL ENERGY EQUATION |
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| Peng Ce.THE HARM OMC FUNCTION EXPRESSION OF THE ADHESIONAL ENERGY EQUATION[J].Journal of Institute of Surveying and Mapping,1989(1). |
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| Authors: | Peng Ce |
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| Abstract: | Adhesionai energy is a important paramater describing the interactions between molecules on the interface. This paper has given the concrete harmonic function expression of the adhesional energy equation, and discussed the varying characterisfies of the factors in the equation. Applying the equation to the pressing plate, Some research results have been tested and verified. The application shows that the conclusions of using such a harmonic function expression of the equation accord with the practical conditions on the pressing plate.@Finally, the paper explains the state of interactions between the molecules on the pressing plate, with the use of the two equation's paramater. |
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| Keywords: | Pressing plate Surface energy Harmonic function Paramater of interaction Adhesional energy |
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